#12 - What’s New in Photonics. Deep Dive into Co-Packaged Optics

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#12 - What’s New in Photonics. Deep Dive into Co-Packaged Optics

with Anastasi

18 January 2026

In this episode, I dive into: Why copper is becoming the biggest bottleneck in AI infrastructureHow silicon photonics brings light directly onto the chipThe most recent advancements in this fieldWhy optical interconnects will define the AI scalingRemember to subscribe to the podcast. And thanks for listening. Watch the full episode here: https://youtu.be/KTyNig7enkQ Youtube  https://www.youtube.com/@AnastasiInTech LinkedIn https://www.linkedin.com/in/anastasiintech/ Newsletter https://anastasiintech.substack.com  Instagram  https://www.instagram.com/anastasi.in.tech/